High Temp Plate

The High Temp Plate is designed for materials that require high bed temperature. It tolerates up to 120 °C and is necessary for polycarbonate (PC) and high-temperature variants of PA.

Properties

• Surface: Smooth with high-temperature coating
• Max bed temperature: 120 °C
• Bottom surface on print: Glossy/smooth
• Adhesion: Good at high temperature — releases upon cooling

Best suited for

Material	Bed temperature	Glue stick
ABS	90–110 °C	Yes
ASA	90–110 °C	Yes
PC	100–120 °C	Yes (required)
PA6	80–90 °C	Yes
PA12	70–85 °C	Yes
PA-CF	90–100 °C	Yes

Not suited for

• PLA — the plate runs too hot, PLA adheres too much
• PETG — risk of plate damage without glue stick
• TPU — Engineering Plate is better

Glue stick

Glue stick is strongly recommended (and required for PC) to:

1. Improve first layer adhesion
2. Protect the plate's coating
3. Ease print removal after cooling

Apply a thin, even layer. For PC and PA: use slightly more than for ABS.

PC requires extra care

Polycarbonate (PC) prints at 250–280 °C nozzle and 100–120 °C bed. Without an enclosure (chamber) and High Temp Plate, success rate is very low. Only X1C and P1S are recommended for PC printing.

Maintenance

# After PC/ABS with glue stick:
1. Let plate cool to 50 °C
2. Remove print carefully (flex the plate)
3. Wash with warm water and dish soap
4. Dry thoroughly — water on a hot plate can damage the coating

# Between prints:
1. Wipe with IPA
2. Check coating for wear

Avoid thermal shock

Never place a cold plate on a hot bed, or spray cold IPA on a hot plate. Temperature differences can damage the coating or cause deformation of the steel plate.

Lifespan

The High Temp Plate lasts shorter than the Engineering Plate due to higher thermal stress:

• Normal use (ABS/ASA): 200–400 prints
• Intensive use (PC): 100–200 prints

Replace when visible coating wear is present, or when adhesion problems persist.