High Temp Plate
The High Temp Plate is designed for materials that require high bed temperature. It tolerates up to 120 °C and is necessary for polycarbonate (PC) and high-temperature variants of PA.
Properties
- Surface: Smooth with high-temperature coating
- Max bed temperature: 120 °C
- Bottom surface on print: Glossy/smooth
- Adhesion: Good at high temperature — releases upon cooling
Best suited for
| Material | Bed temperature | Glue stick |
|---|---|---|
| ABS | 90–110 °C | Yes |
| ASA | 90–110 °C | Yes |
| PC | 100–120 °C | Yes (required) |
| PA6 | 80–90 °C | Yes |
| PA12 | 70–85 °C | Yes |
| PA-CF | 90–100 °C | Yes |
Not suited for
- PLA — the plate runs too hot, PLA adheres too much
- PETG — risk of plate damage without glue stick
- TPU — Engineering Plate is better
Glue stick
Glue stick is strongly recommended (and required for PC) to:
- Improve first layer adhesion
- Protect the plate's coating
- Ease print removal after cooling
Apply a thin, even layer. For PC and PA: use slightly more than for ABS.
:::warning PC requires extra care Polycarbonate (PC) prints at 250–280 °C nozzle and 100–120 °C bed. Without an enclosure (chamber) and High Temp Plate, success rate is very low. Only X1C and P1S are recommended for PC printing. :::
Maintenance
# After PC/ABS with glue stick:
1. Let plate cool to 50 °C
2. Remove print carefully (flex the plate)
3. Wash with warm water and dish soap
4. Dry thoroughly — water on a hot plate can damage the coating
# Between prints:
1. Wipe with IPA
2. Check coating for wear
:::danger Avoid thermal shock Never place a cold plate on a hot bed, or spray cold IPA on a hot plate. Temperature differences can damage the coating or cause deformation of the steel plate. :::
Lifespan
The High Temp Plate lasts shorter than the Engineering Plate due to higher thermal stress:
- Normal use (ABS/ASA): 200–400 prints
- Intensive use (PC): 100–200 prints
Replace when visible coating wear is present, or when adhesion problems persist.